The PowlRstage IR3350 MOSFET is a leap forward in electrical engineering and more importantly motherboard design. It allows manufacturers such as Gigabyte to reduce physical space requirements on their PCB layout, drop peak load temperatures by up to 40C and reduce the size of heat spreaders on the mainboard PWM.
Essentially what the IR3550 does is combine the traditional four-chip design of a traditional MOSFET layout, into a singular chip. Some would think this would increase thermal output, as the chip itself would control the flow of higher amperage and voltage, when compared to the individual components previously used. This however is not the case, thanks to the very low loss copper used for the power connections between the MOSFETs.
Essentially this technology is designed for the use on overclocking motherboards, alowing users to reduce the required airflow over the PWM of the motherboard. In real-time real-life testing, Gigabyte showed their new IR3550 chips off, comparing them to their tradition MOSFET design. The IR3550 chip sat happily on 62C under 100% CPU load, while the traditional MOSFET reached a peak temperature of 91.4C.
There isn't enough space (or time) to go into greater detail with this technology, so unfortunately you will need to be patient in waiting for our Computex issue of Atomic. Just to keep you excited until then however, this was far and away the most exciting technology I've witnessed thus far, and I have confidence it will remain that way until the end of Computex week.