According to the Open NAND Flash Interface (ONFI) Working Group, the ONFI 3.0 standard details interface and infrastructure improvements that will accelerate data transfer between solid-state drives and motherboards.
The interface is a chip-level controller that dictates how data is written, read and erased on flash memory.
“The new ONFI 3.0 technology supporting interface transfer rates of up to 400MB/sec is a key NAND capability to support future SSD design,” said Knut Grimsrud, director of storage architecture at Intel, which is one of more than 100 members of the group.
“With this interface performance scaling, ONFI NAND will play an important role in SSD compute development, especially for high-performance computing applications where speed is paramount.”
As well as improving transfer rates, the working group has also outlined plans for new physical connectors and said manufacturers should be able to design more space efficient devices, because it uses half the number of channels.
“ONFI 3.0 incorporates a sophisticated die selection feature that reduces the number of chip enable (CE) pins, which in turn lowers the number of controller pins to make routing more efficient,” the working group said in its announcement.
“Reducing the number of CE pins is especially important for SSDs, providing a significant cost reduction and allowing the extra pins to be assigned to other applications within the system."
This article originally appeared at pcpro.co.uk